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| intel ? mobile board MGM45WU product guide order number: e41916-002 www..net
revision history revision revision history date -001 first release of the intel ? mobile board MGM45WU product guide july 2008 -002 second release of the intel ? mobile board MGM45WU product guide august 2008 if an fcc declaration of conformity marking is present on the board, the following statement applies: fcc declaration of conformity this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harm ful interference, and (2) this devi ce must accept any interference received, including interference that may cause undesired operation. for questions related to the emc perfo rmance of this pr oduct, contact: intel corporation, 5200 n.e. elam young parkway, hillsboro, or 97124 1-800-628-8686 this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equi pment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may ca use harmful interference to radio communications. however, there is no guarantee that interf erence will not occur in a particular installation. if this equipment does cause harmful inte rference to radio or televisi on reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ? reorient or relocate the receiving antenna. ? increase the separation between the equipment and the receiver. ? connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. ? consult the dealer or an experien ced radio/tv technician for help. any changes or modifications to the equipment not expressly approved by intel corporation could void the user?s authority to operate the equipment. tested to comply with fcc stan dards for home or office use. canadian department of comm unications compliance statement this digital apparatus does not exceed the class b limi ts for radio noise emissions from digital apparatus set out in the radio interference regulations of the canadian department of communications. le prsent appareil numerique nmet pas de bruits radiolectriques dpassant les limites applicables aux appareils numriques de la classe b prescrites dans le rglement sur le broullage radiolectrique dict par le ministre des commun ications du canada. disclaimer information in this document is provided in connection with intel ? products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. except as provided in intel?s terms and conditions of sale for such products, intel assumes no liability whatsoever, and intel disclaims any express or implied warranty, relating to sale and/or us e of intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual prop erty right. intel products are not intended for use in medical, life saving, or life sustaining applications. intel may make changes to specifications and product descriptions at any time, without notice. intel ? mobile board MGM45WU may contain design defects or errors known as erra ta which may cause the product to deviate from published spec ifications. current characterized errata are available on request. contact your local intel sales office or your distributor to obtain the late st specifications and before placing your product order. copies of documents which have an ordering number and are referenced in this document, or other intel literature, may be obtained from intel corporation by going to the world wide web site at: http://www.intel.com/ or by calling 1-800-548-4725. intel and the intel logo are trademarks of intel corporation in the u.s. and other countries. * other names and brands may be cl aimed as the property of others. copyright ? 2008, intel corporation. all rights reserved. iii preface this product guide gives information about board layout, component installation, bios update, and regulatory requirements for intel ? mobile board MGM45WU. intended audience the product guide is intended for technically qualified personnel. it is not intended for general audiences. use only for intended applications all intel mobile boards are evaluated as in formation technology equipment (i.t.e.) for use in personal computers (pc) for installati on in homes, offices, schools, computer rooms, and similar locations. the suitabilit y of this product for other pc or embedded non-pc applications or other environments, su ch as medical, indust rial, alarm systems, test equipment, etc. may no t be supported without furt her evaluation by intel. document organization the chapters in this product guide are arranged as follows: 1 mobile board features: a summary of product features 2 installing and replacing mobile board components: instructions on how to install the mobile board and other hardware components 3 updating the bios: instructions on how to update the bios a intel ? mobile utility: information how to use this software to manage your computer b regulatory compliance: safety standards, regulations, and product certifications conventions the following conventions are used in this manual: caution cautions warn the user about how to prevent damage to hardware or loss of data. note notes call attention to important information. intel mobile board MGM45WU product guide iv terminology the table below gives descriptions of some common terms used in the product guide. term description gb gigabyte (1,073,741,824 bytes) ghz gigahertz (one billion hertz) kb kilobyte (1024 bytes) mb megabyte (1,048,576 bytes) mbit megabit (1,048,576 bits) mhz megahertz (one million hertz) v contents 1 mobile board features mobile board components ................................................................................... 11 proce ssor.......................................................................................................... 17 system memory................................................................................................. 17 intel ? gm45 expre ss chipset ............................................................................... 18 intel gm45 graphi cs subsystem........................................................................... 18 mobile embedde d contro ller ................................................................................ 19 intel ? turbo memory .......................................................................................... 19 audio subsystem ............................................................................................... 19 touch pad support ............................................................................................. 20 status leds and quick buttons ............................................................................ 20 status leds ............................................................................................... 20 quick buttons ............................................................................................ 22 keyboard support .............................................................................................. 23 language support ...................................................................................... 23 function keys/hot keys............................................................................... 24 connectivity ...................................................................................................... 26 integrated gigabi t ethernet lan ................................................................... 26 lan software...................................................................................... 26 lan status indica tors .......................................................................... 26 wireless la n support.................................................................................. 27 bluetooth* tec hnology support .................................................................... 27 modem su pport.......................................................................................... 27 microphone support ........................................................................................... 27 intel ? active management technology (intel ? amt) ................................................ 28 expandability..................................................................................................... 28 external usb 2.0 support ............................................................................ 28 expresscard* support................................................................................. 29 pci express* support ................................................................................. 29 docking statio n connector........................................................................... 29 storage ............................................................................................................ 30 bios ................................................................................................................ 30 serial ata auto configuration....................................................................... 30 pci express auto configuration .................................................................... 30 security passwords ..................................................................................... 30 hard disk dr ive passwords........................................................................... 31 hard disk drive password feature during bios post ............................... 31 intel ? trusted platform module (intel ? tpm) .......................................................... 32 fingerprint reader support (optional) ................................................................... 32 smart card reader support (optional) .................................................................. 32 power and powe r manage ment............................................................................. 33 power supply an d battery pack .................................................................... 33 power mana gement .................................................................................... 33 cmos battery.................................................................................................... 34 intel mobile board MGM45WU product guide vi 2 installing and replacing mobile board components before yo u begin ............................................................................................... 35 installing a processor ......................................................................................... 37 installing the th ermal mo dule .............................................................................. 38 attaching th e i/o bezel....................................................................................... 40 installing a modem............................................................................................. 41 installing expans ion boar d a ............................................................................... 42 installing the mo bile bo ard .................................................................................. 43 connecting the mobile boar d to expansio n board a.......................................... 43 attaching the c-plat e to the d-tray ............................................................... 45 connecting cables to the bottom of the mo bile board .............................................. 46 attaching the touch pad and the fing erprint reader (o ptional) cables ....................... 47 attaching the lid/lcd ......................................................................................... 49 installing an opti cal disk drive ............................................................................ 52 installing a hard disk drive ................................................................................. 53 installing a keyboard and keyboard cover............................................................. 54 installing a keyboard .................................................................................. 54 installing the ke yboard cover ...................................................................... 55 installing syst em memory ................................................................................... 56 installing a wire less lan card ............................................................................. 57 installing an intel ? turbo memo ry card................................................................. 59 setting the bios co nfiguration jumper ................................................................. 61 completing assembly of the chassis ..................................................................... 62 installing the hard di sk drive ba y cover........................................................ 62 installing the d-tray door ............................................................................ 63 clearing or chan ging passwords........................................................................... 64 clearing bios secu rity passwords................................................................. 64 clearing or changing hard disk drive passwords............................................. 65 3 updating the bios updating the bios with the intel ? express bios u pdate utility................................. 67 updating the bios with the iso image bios update file or the iflash memory upda te utility ................................................................................... 68 obtaining the bios update file .................................................................... 68 updating the bios with the iso image bios update file ................................. 68 updating the bios with the if lash memory up date ut ility ................................. 69 recovering the bi os ................................................................................... 70 a intel ? mobile utility b regulatory compliance safety st andards ............................................................................................... 75 battery disposal information ............................................................................... 76 european union declaration of conformity statement.............................................. 80 product ecolog y statements ................................................................................ 81 recycling cons iderations ............................................................................. 81 lead-free 2li/pb-f ree 2li board ................................................................... 84 restriction of hazardou s substances (rohs) .................................................. 85 eu rohs ............................................................................................ 85 china rohs ........................................................................................ 86 contents vii emc regulations ................................................................................................ 88 ensure electromagnetic comp atibility (emc) compliance .................................. 89 product certifications.......................................................................................... 90 board-level certif ication markings ................................................................ 90 chassis and componen t certifications............................................................ 91 figures 1. intel mobile board mg m45wu components (top) .............................................. 11 2. intel mobile board mgm 45wu components (bottom) ......................................... 13 3. intel mobile boar d MGM45WU i/ o ports ........................................................... 15 4. expansion boar d a components ..................................................................... 15 5. expansion boar d a i/o ports .......................................................................... 16 6. intel mobile board MGM45WU indi cator leds ................................................... 20 7. intel mobile board MGM45WU quic k buttons .................................................... 22 8. intel mobile boar d MGM45WU hot keys ........................................................... 24 9. installing a proce ssor .................................................................................... 37 10. installing the thermal module ........................................................................ 39 11. attaching the i/o bezel ................................................................................. 40 12. installin g a modem ....................................................................................... 41 13. installing expansion board a in the d-tray ....................................................... 42 14. connecting the mobile bo ard to expans ion board a ........................................... 44 15. attaching the c-pl ate to th e d-tray ................................................................. 45 16. connecting cables to the bottom of the mo bile board ........................................ 46 17. attaching the touch pad an d fingerprint re ader ca bles ..................................... 48 18. attaching the lid/lcd to the hinges and connecting the lvds cable ................... 50 19. securing the lid/lc d hinge alignment pins ...................................................... 51 20. installing an op tical disk drive ....................................................................... 52 21. installing a ha rd disk drive............................................................................ 53 22. installing a keyb oard .................................................................................... 54 23. installing a ke yboard cover ........................................................................... 55 24. insta lling di mms .......................................................................................... 56 25. installing a pci express full-mini wire less lan card .......................................... 57 26. installing a pci express half-mini wire less lan card ......................................... 58 27. connecting th e antenna wires........................................................................ 58 28. installing a pci express full-mini intel turb o memory card................................. 59 29. installing a pci express half -mini intel turb o memory card ................................ 60 30. bios config uration jumper ............................................................................ 61 31. installing the hard disk driv e cover................................................................ 62 32. installing th e d-tray door .............................................................................. 63 33. intel mobile board MGM45WU china ro hs material self declaration table ............ 87 intel mobile board MGM45WU product guide viii tables 1. feature summary.......................................................................................... 9 2. intel mobile board mgm 45wu components (top) .............................................. 12 3. intel mobile board mgm45w u components (bottom) ......................................... 14 4. intel mobile board MGM45WU i/ o ports ........................................................... 15 5. expansion board a components ..................................................................... 16 6. expansion board a i/o po rts .......................................................................... 16 7. intel mobile board mg m45wu indica tor leds ................................................... 21 8. intel mobile board mg m45wu quick buttons .................................................... 22 9. keyboard matrix assign ment for 32 languages ................................................. 23 10. intel mobile board MGM45WU ho t keys ........................................................... 25 11. lan connec tor leds ..................................................................................... 26 12. wake-up devices and events when operating on battery power.......................... 33 13. wake-up devices and events when operating on ac adapter power .................... 34 14. jumper settings for the bi os setup prog ram modes.......................................... 61 15. safety st andards.......................................................................................... 75 16. lead-free second level intercon nect marks ..................................................... 85 17. china rohs environmentally friendly use period mark ....................................... 86 18. emc regulations........................................................................................... 88 19. product certific ation markings ........................................................................ 90 9 1 mobile board features this chapter briefly describes the features of intel ? mobile board MGM45WU. table 1 summarizes the major features of the mobile board. table 1. feature summary board dimensions rich creek 2 standard (220 mm x 213 mm) form factor processor support for intel ? core?2 duo mobile processors with a 1066/800 fsb and intel ? celeron ? mobile processors with a 667 fsb via an mpga479 socket system memory ? two 200-pin, ddr2 sdram small outline dual inline memory module (so-dimm) sockets ? 800/667 mhz dual-channel interleaved mode ddr2 sdram interface ? support for up to 4 gb of system memory (2 gb per channel) intel ? turbo memory support for an optional intel ? turbo memory card via the pci express* full-mini and half-mini card connectors chipset mobile intel ? gm45 express chipset consisting of: ? mobile intel gm45 express chipset graphics and memory controller hub (gmch) ? intel ? 82801iem ich9 mobile enhanced (intel ? ich9m-e) i/o controller graphics ? mobile intel ? graphics media accelerator 4500mhd (intel ? gma 4500mhd) ? dvi-i single link output (vga is available with a dvi-i-to-vga adapter) audio ? intel ? high definition audio (intel ? hd audio) via the realtek* alc269 audio codec ? onboard analog microphone ? two analog audio jacks (mic/line in and line out/headphones) on expansion board b connectivity ? intel 82567lm gigabit (10/100/1000 mb/s) ethernet lan controller including support for amt ? support for an optional 56k modem via an rj-11 connector and an onboard mdc connector ? support for an optional 802.11 a/g/n wireless lan add-in card via the pci express full-mini and half-mini card connectors ? bluetooth* support expandability ? four external usb 2.0 ports: D one on the mobile board D two on expansion board a D one on expansion board b ? expresscard*/34 slot ? one pci express full-mini card connector ? one pci express half-mini card connector ? bottom docking connector continued intel mobile board MGM45WU product guide 10 table 1. feature summary (continued) storage ? two 300 mb/s sata interfaces: one supporting a hard disk drive and one supporting an optical disk drive embedded controller ? winbond* wpc8763l mobile embedded controller which provides the following: D keyboard control D touch pad D thermal module fan control D spi flash interface bios ? intel ? extensible firmware interface (efi) bios ? support for smbios ? intel ? rapid bios boot ? intel ? express bios update manageability support for intel ? active management technology (intel ? amt) security intel ? trusted platform module (intel ? tpm), revision 1.2, enhances platform security. operating system support ? microsoft windows vista*, sp1 D all 32-bit versions D all 64-bit versions ? microsoft windows* xp, sp2 and sp3 D professional D home ? microsoft windows* xp 64-bit 64-bit driver support for all subsystems miscellaneous ? support for a fingerprint reader via usb ? support for a web camera via usb ? support for a smart card reader via expansion board b ? support for digital array microphones ? support for intel ? power manager ? support for wave systems corporation embassy* trust suite (ets) oem version mobile board features 11 mobile board components figure 1 shows the location of the major co mponents on the top side of intel mobile board MGM45WU; table 2 identifies the components. figure 1. intel mobile bo ard MGM45WU components (top) intel mobile board MGM45WU product guide 12 table 2. intel mobile boar d MGM45WU components (top) label description a expresscard/34 slot b power button c lvds/lid connector d analog microphone e id expansion connector a f keyboard connector g id expansion connector b (fingerprint reader) h touch pad connector i touch pad buttons j battery led k machine status led l hard disk drive led m caps lock led n num lock led o wireless led p bluetooth led mobile board features 13 figure 2 shows the location of the major components on the bottom side of intel mobile board MGM45WU; table 3 identifies the components. figure 2. intel mobile boar d MGM45WU components (bottom) intel mobile board MGM45WU product guide 14 table 3. intel mobile board MGM45WU components (bottom) label description a dvi-i connector b usb 2.0 connector c rj-11 (telephone) connector d modem (mdc) connector e cmos battery f bios configuration jumper g processor socket h modem connector i thermal module fan connector j pci express full-mini card connector k speakers connector l expansion board b connector m bluetooth connector n hard disk drive (sata) connector o pci express half-mini card connector p optical disk drive (sata) connector q expansion board a board-to-board connector r expansion board a connector s battery pack connector t docking connector u dimm 2 socket v dimm 1 socket mobile board features 15 figure 3 is a side view of the mo bile board showing its i/o ports; table 4 identifies the ports. figure 3. intel mobile board MGM45WU i/o ports table 4. intel mobile board MGM45WU i/o ports label description a expresscard/34 slot b rj-11 connector c usb 2.0 connector d dvi-i connector figure 4 shows the location of the majo r components on the top and bottom of expansion board a; table 5 identifies the components. figure 4. expansion board a components intel mobile board MGM45WU product guide 16 table 5. expansion board a components label description a expansion board a connector b expansion board a board-to-board connector c dc power jack d rj-45 (lan) connector e usb 2.0 connector f usb 2.0 connector g audio mute button h + volume button i ? volume button j wireless radio on/off button k launch internet browser button figure 5 is a side view of expans ion board a showing its i/o ports; table 6 identifies the ports . figure 5. expansion board a i/o ports table 6. expansion board a i/o ports label description a usb 2.0 connector b usb 2.0 connector c rj-45 (lan) connector d dc power jack mobile board features 17 processor intel mobile board MGM45WU supports the following intel ? processors in the mpga479 package: ? intel core 2 duo mobile processors with a 1066/800 fsb ? intel celeron mobile processors with a 667 fsb processors are not included with the mobile board and must be purchased separately. for instructions on installing a processor, go to page 37 in chapter 2. system memory note to be fully compliant with all applicable intel ? sdram memory specifications, the board should be populated wi th dimms that support the se rial presence detect (spd) data structure. if your memory modu les do not support spd, you will see a notification to this effect on the screen at power up. the bios will attempt to configure the memory controller for normal operation. the mobile board supports the dual or sing le channel memory configurations defined below. ? two 200-pin double data rate 2 (ddr2) small outline dual inline memory module (so-dimm) sockets with gold-plated contacts ? support for: ? non-ecc ddr2 800/667 memory ? serial presence detect (spd) memory only ? unbuffered, non-registered si ngle- or double-sided dimms ? memory configurations listed below: ? up to 2.0 gb utilizing 256 mb technology ? up to 4.0 gb utilizing 512 mb or 1 gb technology for instructions on installing memory, refer to ?installing system memory? on page 56 in chapter 2. intel mobile board MGM45WU product guide 18 intel ? gm45 express chipset the intel gm45 express chipset cons ists of the following devices: ? intel gm45 express chipset graphics and memory controller hub (gmch) with direct media interface (dmi) ? intel 82801iem ich9 mobile enhanced (intel ich9m-e) i/o controller hub the gmch provides interfaces to the proc essor, memory, and the dmi interconnect. the component also provides integrated gr aphics capabilities supporting 3d, 2d, and display capabilities. the intel ich9m-e is the centralized controller for the board?s i/o paths. for more information on the intel gm45 express chipset, go to http://developer.intel.com/products/chipsets/ intel gm45 graphics subsystem the intel gm45 express chipset contains the intel graphics media accelerator 4500mhd (gma 4500mhd) graphics controller. the graphics controller supports external displays via the dv i-i connector on the side of the mobile board. the intel gma 4500mhd graphics controller has the following features: ? advanced graphics performance, including: ? directx10.0* and opengl* 2.0 compliance ? shader model 4.0 support ? enhanced video playback support, including: ? playback of hd-dvd and blu-ray disc* technology dvds ? software dvd at 30 fps full screen ? advanced display support, including: ? dvi specification 1.0 compliance ? high definition content protection (hdcp) version 1.1 compliance ? external digital and analog dvi display support. analog si gnals are available with a dvi-to-vga adapter. ? hd display support including 720p, 1080i, and 1080p ? external digital and analog display support up to 2048 x 1536 at a 75-hz refresh rate (qxga). also supports 1920 x 1080 resolution for full high definition video pl ayback quality. mobile board features 19 mobile embedded controller the winbond* wpc8763l mobile embedde d controller features the following: ? low pin count (lpc) interface ? fan speed closed loop control vi a pulse width modulation (pwm) ? keyboard/mouse controller ? touch pad controller intel ? turbo memory the mobile board provides support for inte l turbo memory by providing two onboard pci express mini card connectors in whic h an intel turbo memory card can be installed: one half-mini and one full-mini connector. intel turbo memory uses flash memory techno logy and software drivers to deliver an enhanced mobile experience when using microsoft windows vista. intel turbo memory enhances processor performance by speeding up data going to the intel core 2 duo processor. it helps the processor by st oring large amounts of frequently used information for faster access: ? results in less system lag time ? stores data the processor is likely to need ? enhances the ability of windows vista to remember and store key data from your frequently used applications refer to ? installing an intel ? turbo memory card? on page 59 for instructions for installing an intel turbo memory card on the mobile board. audio subsystem the onboard audio subsystem features the following: ? realtek* alc269 audio codec with a si gnal-to-noise (s/n) ratio of 95 db ? intel high definition audio usin g integrated chassis speakers ? support for independent multistreaming audio for audio out the integrated speakers and stereo out the notebook headphone jack ? support for two integrated 1-watt, 8-ohm speakers via the speakers connector on the mobile board ? support for two analog external audio ports on expansion board b: ? mic/line-in jack ? headphone jack ? support for two digital arra y microphones via the lid/lvds features connector on the mobile board ? onboard analog microphone intel mobile board MGM45WU product guide 20 go to the following locations for more information about: ? audio drivers and utilities http://support.intel.com/support/mobile ? location of the onboard audio connectors see , figure 2 on page 13 touch pad support the mobile board supports a touch pad for cursor control. the touch pad is preinstalled in the chassis. the mobi le board includes a touch pad connector ( figure 1, g) and two touch pad button switches ( figure 1, h). the touch pad and butto n switches can be disabled in the mobile board bios. refer to ? attaching the touch pad and the fingerprint read er (optional) cables? on page 47 for information on connecting the touch pad cable to the mobile board. status leds and quick buttons this section presents an over view of the status leds and ?quick buttons? included on the mobile board. status leds the indicator leds included on the mobile board are show in figure 6 and described in table 7. figure 6. intel mobile board MGM45WU indicator leds mobile board features 21 table 7. intel mobile board MGM45WU indicator leds figure ref. led color state indicates blinking bluetooth wireless activity is occurring. a bluetooth wireless green off bluetooth wireless connection is not established. blinking wireless lan activity is occurring. b wireless lan green off wireless lan connection is not established. on num lock is on. c num lock green off num lock is off. on caps lock is on. d caps lock green off caps lock is off. blinking hard disk drive is being accessed. e hdd activity green off hard disk drive is idle. off board is in acpi state s0 or s4. f machine status green on board is in acpi state s3. on battery not installed; operating on ac power on operating on battery; battery fully charged green blinking battery charging; charge >90% on battery charging; charge <90% g battery/ac power amber blinking low battery intel mobile board MGM45WU product guide 22 quick buttons the quick buttons are located on the top of expansion board a (see figure 7). they control certain pre-defined functions of th e notebook. after chassis assembly, the quick buttons are accessible to the user on the top left of the chassis directly above the keyboard. these buttons provide quick access to the common functions listed in table 8. figure 7. intel mobile board MGM45WU quick buttons table 8. intel mobile board MGM45WU quick buttons button function a internet: pressing this button launches the default web browser. b wireless radios on/off: pr essing this button toggles the wireless radios on and off. c volume down: pressing this button decreases the audio from the notebook speakers. d volume up: pressing this button increases the audio from the notebook speakers. e audio mute: pressing this button silences the audio from the notebook speakers. mobile board features 23 keyboard support the mobile board supports cbb keyboards which support 32 languages and 12 function keys. language support the mobile board supports 32 languages vi a four keyboard matrices that can be selected in the bios setup program. th e keyboard matrix choices are as follows: ? united states (us) (default) ? united kingdom (uk) ? japan (ja) ? brazil (br) table 9 lists the languages and countrie s supp orted by each of the matrices. table 9. keyboard matrix assignment for 32 languages number languages and countries abbreviation keyboard matrix 1 us us us 2 fr canada cf uk 3 arabia ar uk 4 belgium be uk 5 czech republic cz us 6 denmark dm uk 7 france fr uk 8 germany gr uk 9 greece/poland gk uk 10 hungary hg uk 11 israel (hebrew) hb uk 12 italy it uk 13 netherlands dt uk 14 norway nw uk 15 portugal po uk 16 russian ru uk 17 spain sp uk 18 sweden/finland sd/fl uk 19 switzerland (gr/fr/it/en) sw uk 20 turkey tr uk 21 uk uk uk 22 japan ja ja 23 iceland ice uk 24 latin america la uk continued intel mobile board MGM45WU product guide 24 table 9. keyboard matrix assignment for 32 languages (continued) number languages and countries abbreviation keyboard matrix 25 brazil uk br 26 thailand ti us 27 prc chinese sc us 28 slovakia sk uk 29 taiwan ch us 30 korea kr us 31 us-intl ui us 32 poland pl uk function keys/hot keys the top row of the keys on the keyboard are the function keys: f1 to f12 (see figure 8 for the location of the function keys). function keys are multi-purpose keys that perform functions define d by individual programs. hot key functions are assigned to the f1 to f12 keys by your computer. when the mobile utility software is installed on your computer, the functions defined in table 10 are av ailable to the user. refer to appendix a for more information on the mobile utility. figure 8. intel mobile board MGM45WU hot keys mobile board features 25 table 10. intel mobile board MGM45WU hot keys function key description sleep/hibernate: pressing this key combination causes a pop-up window to appear and ask the user if they want to place the computer in sleep (s3) or hibernate (s4) mode. wireless radios on/off: pressing this key combination causes a pop-up window to appear and ask the user if they want to turn wireless lan or bluetooth off or on. video output selection: pressing this key combination causes a pop-up window to appear which allows the user to switch the display to external devices. decrease lcd brightness: pressing this key combination decreases the lcd brightness. increase lcd brightness: pressing this key combination increases the lcd brightness. audio mute: pressing this key combination silences the audio. volume decrease: pressing this key combination decreases the audio volume. volume increase: pressing this key combination increases the audio volume. play/pause: pressing this key combination plays or pauses audio or video playback. stop: pressing this key combination stops audio or video playback. rewind: pressing this key combination rewinds video or moves audio back a track. fast forward: pressing this key co mbination fast forwards a video or moves audio forward a track. intel mobile board MGM45WU product guide 26 connectivity this section describes the various features the mobile board provides to connect to networks and the internet. integrated gigabit ethernet lan the lan subsystem includes: ? intel ich9m-e ? intel 82567lm gigabit (10/100/1000 mb/s) et hernet lan controller with support for: ? intel amt ? alert standard format (asf) 2.0 ? virtual lan driver support for intel ? virtualization technology (intel ? vt) partitions ? rj-45 lan connector with integrated status leds on expansion board a the subsystem also features: ? csma/cd protocol engine ? lan connect interface between th e ich9m-e and the lan controller ? pci bus power management lan software for information about lan software and drivers go to http://support.intel.com/support/mobile . lan status indicators two leds are built into the rj-45 lan co nnector located on expansion board a (see figure 5, c). these leds indicate the operating states of the lan. table 11 describes the led states when the b oard is powered on and the lan subsystem is operating. table 11. lan connector leds led led color led state indicates link off lan link is not established. yellow on lan link is established. blinking lan activity is occurring. amber on 10 mb/s data rate green on 100 mb/s data rate speed yellow on 1000 mb/s data rate mobile board features 27 wireless lan support the mobile board provides support for a wireless lan via the onboard pci express mini card connectors. both full-mini and ha lf-mini cards are supported (refer to ? installing a wireless lan card? o n page 57 for installation instructio ns). wireless connectivity can be provided by intel ? pro/wireless network connection cards. the intel pro/wireless network connection provides deployment flexibility and connectivity convenience by offering a choice of pr oducts including a tri-mode (supporting 802.11a/g/n) product. bluetooth* technology support the mobile board includes a bluetooth usb connector to support a bluetooth module installed in the notebook chassis. the bluetooth module must have the following features: ? self-contained antenna ? support for usb selective suspend ? coexistence with the wireless lan adapter ? able to be completely disabled by the mobile board bios modem support the mobile board supports a 56k modem by providing the following: ? onboard modem-only motherboard daug hter card (mdc) 1.5 connector ? mdc mounting standoffs ? rj-11 connector refer to ? installing a modem? on page 41 for modem installation instructions. microphone support intel mobile board MGM45WU supports analog and digital microphones. an analog microphone (see figure 1, d) is located on the mobile board under the notebook keyboard co ver. an optional digital array mi crophone can be installed in the lid of the notebook. the mobile board bios setup ha s a microphone selection option to allow the user to select either an analog or di gital microphone. only one microphone type can be used at a time. intel mobile board MGM45WU product guide 28 intel ? active management technology (intel ? amt) intel amt offers it organizations tamper -resistant and persistent management capabilities. intel amt is a hardware-based solution that uses out of band communication to manage acce ss to client systems in addi tion to offering encrypted and persistent asset management and remote diagnostics and/or re covery capabilities for networked platforms. with intel amt, it organizations can easily get accurate platform information, and can perform remo te updating, diagnostics, debugging and repair of a system, regardless of the state of the operating system or the power state of the system. the intel amt subsystem consists of: ? arc4 microcontroller embedded in the intel gm45 graphics and memory controller hub (gmch) ? intel ich9m-e ? intel 82567lm gigabit (10/100/1000 mb /s) ethernet lan controller ? channel a so-dimm ? bios/spi flash note software with intel amt capability is requ ired to take advantage of the intel amt platform management capabilities. for more information about intel amt and the availability of third-party software, go to http://intel.com/technology/platform-technology/intel-amt expandability for system expansion, the mobile board provides the following: ? external usb 2.0 ports ? expresscard*/34 socket ? two pci express mini card slots ? docking connector external usb 2.0 support the mobile board supports four ex ternal usb 2.0 ports as follows: ? one port on the mobile board ? two ports on expansion board a ? one port on expansion board b usb 2.0 ports are backward compatible with usb 1.1 devices. usb 1.1 devices will function normally at usb 1.1 speeds. mobile board features 29 usb 2.0 support requires both an operatin g system and drivers that fully support usb 2.0 transfer rates. disabling hi-speed usb in the bios reverts all usb 2.0 ports to usb 1.1 operation. this may be requir ed to accommodate operating systems that do not support usb 2.0. expresscard* support the mobile board includes an expressc ard/34 (34 mm wide) slot that accepts a standard expresscard/34 module. this slot allows you to easily add features that are not otherwise available in your notebook. you can add features such as memory, digital media readers (compactflash*, sd*, et c.), wireless connectivi ty, or a tv tuner. pci express* support the mobile board includes two pci express mini card connectors: one full-mini card connector and one half-mini card connector . these connectors are used to add wireless lan and intel turbo memory card s to the mobile board. refer to ? installing a wireless lan card? o n page 57 and ? installing an intel ? turbo memory card? on page 59 for information on installing cards in these connectors. docking station connector the docking station connector ( figure 2, u) located on the bottom of the mobile board provides an external interface to a dock ing station. the connector provides the signals to support the following co nnectors on the docking station: ? vga (the analog signals to the mobile board dvi-i connector are disabled when the docking station is detected) ? dvi (the digital signals to the mobile bo ard dvi-i connector are disabled when the docking station is detected) ? one usb 2.0 port (used for usb hub in th e docking station which provides four usb ports) ? one esata port ? rj-45 (the rj-45 connector on the notebook is disabled when the docking station is detected) ? headphone jack (speakers on the notebook are muted when a device is detected on this jack) ? microphone jack (the microphone jack on th e notebook is disabled when a device is detected on this jack) ? dc power in (used to power the note book and charge the battery pack) ? power on/off switch (used to power the note book on and off with the lid open or closed) intel mobile board MGM45WU product guide 30 storage the mobile board supports tw o types of storage devices: ? optical disk drives ? hard disk drives the mobile board supports two serial ata channels (3.0 gb/s) via the intel ich9m-e, connecting one device per chan nel. two connectors are provided: one for an optical disk drive ( figure 2, p) and one for a hard disk drive ( figure 2, n). refer to chapter 2 f or instructions on how to install an optical disk drive or a hard disk drive. bios the bios provides the power-on self-test (post), the bios setup program, the pci express auto-configuration utilities, and the video bios. the bios is stored in the serial peripheral interf ace (spi) flash device. the bios can be updated by following the instructions in chapter 3. serial ata auto configuration if you install a serial ata device (such as a hard disk drive or optical disk drive) in your notebook, the auto-configuration util ity in the bios automatically detects and configures the device for your computer. you do not need to run the bios setup program after installing a serial ata device. you can over ride the auto-configuration options by specifying manual configuration in the bios setup program. pci express auto configuration if you install a pci express mini card in your computer, the pci express auto- configuration utility in the bios automatically detects and configures the resources (irqs, dma channels, and i/o space) for that card. you do not need to run the bios setup program after you install a pci express mini card. security passwords the bios includes security features that restrict whether the bios setup program can be accessed and who can boot the computer. a supervisor password and a user password can be set for the bios setup and for booting the computer, with the following restrictions: ? the supervisor password gives unrestricted access to view and change all setup options. if only the supervisor password is set, pressing mobile board features 31 ? setting a user password restricts who ca n boot the computer. the password prompt is displayed before the computer is booted. if only the supervisor password is set, the computer boots with out asking for a password. if both passwords are set, you can enter eith er password to boot the computer. for instructions on resetting the password, see ? clearing bios securi ty pas swords? on page 64. hard disk drive passwords the hard disk drive password security feature will lock a particular drive from read or write accesses until the hard disk drive pa ssword is entered at the startup prompt. passwords are set in bios setup under the ?security? heading, but do not interact with other system passwords. there are two levels of hard disk drive passw ords: master and user. both the master and user hard disk drive passwords can be used to unlock a locked drive. valid passwords are between two and eight characters. the passwords function as follows: ? the user hard disk drive password will lock the drive and block read and write accesses to a hard disk upon each power cycle or reset. ? the master hard disk drive password by itse lf will not lock the drive, but instead acts as an unlock override in the event that the user hard disk drive password is unavailable. only the installation of the user hard disk drive password will cause a hard disk to be locked upon a system power cycle or reset. for convenient support of s3 resume, the sy stem bios will automatically unlock drives on resume from s3 and will not prompt for a hard disk drive password. for instructions on resetting the password, see ? clearing or changing hard disk drive passwords ? on page 65. hard disk drive password feature during bios post during every bios post execution, if a user hard disk drive password is present on the hard drive, post execution will pause to prompt the user to enter the master or user password: enter hard disk drive password: upon successful entry of the master or user hard disk drive password, the system will continue with normal post. intel mobile board MGM45WU product guide 32 if the hard disk drive password is not correctly entered, the system will go back to the above prompt. the user will have three attempts to correctly enter the correct hard disk drive password. after the third unsuccessful attempt, the system will halt with the following message: hard disk drive password entry error the bios will then lock the drive from further activity, re quiring a power-cycle to re- attempt hard disk drive password entry. intel ? trusted platform module (intel ? tpm) the intel tpm component is designed to en hance platform security above and beyond the capabilities of today?s software by pr oviding a protected space for key operations and other security critical tasks. using both hardware and software, the tpm protects encryption and signature keys at their mo st vulnerable stage s?operations when the keys are being used unencrypte d in plain-text form. the tpm is specifically designed to shield unencrypted keys and platform authentication information from software- based attacks. the wave systems corporation embassy* trust suite (ets) 6 is incl uded on the intel express installer dvd included with the mo bile board. ets 6 works with the tpm device on the mobile board to deliver advanced levels of security to your notebook pc. note the intel tpm uses the onboard coin-cell ba ttery (cr2032) to maintain its monotonic counters. one major function of the monoto nic counters is for anti-replay protection of the internal intel tpm data. if the batte ry is removed or exhausted, the intel tpm data will be deleted in accordance with trusted comp uting group guidelines. please read the intel tpm user guide and back-up intel tpm keys and data before removing the battery. fingerprint reader support (optional) intel mobile board MGM45WU will support the use of a fingerprint reader for secure access to the notebook and data. the finger print reader is supported in microsoft windows xp and microsoft windows vista wh en used with the wave systems embassy trust suite application. the mobile board has support for using the fingerprint reader for pre-boot authentication during boot of the notebook. this feature can be enabled from the wave systems embassy trust suite application. smart card reader support (optional) intel mobile board MGM45WU will support a smart card reader on expansion board b for secure access to the notebook and data. support for this device is available when using the wave systems embassy trust suite application. mobile board features 33 power and power management power supply and battery pack a cbb-compliant 65 w ac power adapter is used to supply dc power to the mobile board. 2200 mah/2400 mah/2600 mah 6-cell or 2400 mah/2600 mah 9-cell li compliant battery packs can be used for mobile power. the battery pack plugs into a connector on the mobile board (see figure 2, s). refer to t he notebook motherboard specification for more information. power management the mobile board supports the latest version of the advanced configuration and power interface (acpi) specification. acpi gives the operating system direct co ntrol over the power management and plug and play functions of a computer. the us e of acpi with the board requires an operating system that provides full acpi su pport such as microsoft windows vista. acpi features include: ? plug and play (including bus and device enumeration) ? power management control of individual devices, add-in cards (some add-in cards may require an acpi-aware driver), and hard disk drives ? a soft-off feature that enables the oper ating system to power-off the computer ? support for multiple wake-up events (see table 12 and table 13) ? support for a sleep/hibernate mode switch acpi gives the operating system direct co ntrol over the power management and plug and play functions of a computer. the use of acpi with the mobile board requires an operating system that provides full acpi support. table 12. wake-up devices and events when operating on battery power these devices/events can wake up the computer? ?from this state power button s3, s4, s5 rtc alarm s3 lan (onboard) n/a usb n/a pci express (wlan) n/a lid switch s3 keyboard n/a touch pad n/a modem n/a intel mobile board MGM45WU product guide 34 table 13. wake-up devices and events when operating on ac adapter power these devices/events can wake up the computer? ?from this state power button s3, s4, s5 rtc alarm s3, s4, s5 lan (onboard) s3, s4, s5 usb s3 pci express (wlan) s3, s4 lid switch s3 keyboard s3 touch pad n/a modem s3, s4 cmos battery a battery ( figure 2, e) on the mobile board ke eps the values in cmos ram and the clock current when the computer is turned off. if you should need to replace the battery, refer to ? battery disposal information? on page 76 for battery disposal in formation. 35 2 installing and replacing mobile board components this chapter tells you how to: ? install a processor ? install the thermal module ? attach the i/o bezel ? install a modem ? install expansion board a ? installing the mobile board in the chassis ? connect cables to the bottom of the mobile board ? attach the touch pad and fingerprint reader (optional) cables ? attach the lid/lcd ? install an optical disk drive ? install a hard disk drive ? install a keyboard and keyboard cover ? install system memory ? install a wireless lan card ? install intel turbo memory ? set the bios configuration jumper ? complete assembly of the chassis ? clear passwords note the procedures in this chapter are illustrated by installing the mobile board in a typical chassis that complies with the notebook motherboard specification. your chassis may vary in some instances. refer to the chassis manufacturer fo r more information. before you begin caution the procedures in this chapter assume familiarity with the general terminology associated with personal computers and wi th the safety practices and regulatory compliance required for using and modifying electron ic equipment. follow these guidelines before you begin: ? always follow the steps in each procedure in the correct order. ? set up a log to record information about your computer, such as model, serial numbers, installed options, and configuration information. intel mobile board MGM45WU product guide 36 ? electrostatic discharge (esd) can damage components. perform the procedures described in this chapter only at an esd workstation using an antistatic wrist strap and a conductive foam pad. if such a station is not available, you can provide some esd protection by wearing an antist atic wrist strap and attaching it to a ground. when you install and test the intel mobile board, observe all warnings and cautions in the installation instructions. to avoid injury, be careful of: ? sharp pins on connectors ? sharp pins on printed circuit assemblies ? hot components (such as processors and heat sinks) ? damage to wires that co uld cause a short circuit observe all warnings and cautions that instruct you to refer servicing to qualified technical personnel. read and adhere to the instructions in this chapter and the instructions supplied with the chassis and associated components. if you do not follow these instructions and the instructions provided by the chassis and component suppliers, you increase safety risk and the possibility of no ncompliance with regional laws and regulations. if the instructions for the chassis are inconsistent with these instructions or the instructions for other components, contact the supplier?s technical support to find out how you can ensure that your notebook meets safe ty and regulatory requirements. for information about regulatory comp liance, go to appendix b on page 75. installing and replacing mobile board components 37 installing a processor this section describes how to install a processor on the mobile board (see figure 9). caution take care when handling the processor. ho ld it by the edges to avoid touching the pins. touching the pins may damage the processor. to install a processor, follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. locate the processor socket on the bottom of the mobile board ( figure 2, g). 3. usin g a small flat-blade screwdriver, rotate the processor socket locking screw to the unlocked position ( figure 9, ). 4. align the processor ( figure 9, a) with the processor socket ( figure 9, b) so that the tri angles match as shown in the figure. 5. insert the processor in the processor socket ( figure 9, ). 6. rotate the processor socket lockin g screw to the locked position ( figure 9, ). figure 9. installing a processor intel mobile board MGM45WU product guide 38 installing the thermal module to install the thermal module on the proc essor and the gmch and connect the thermal module fan, see figure 10 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. remove the thermal interface material (tim) protective covering ( figure 10, a) from the bottom of the thermal module as shown in the figure. 3. remove the paper backing from the heatsink backing plate ( figure 10, b) to expose the adhesive and then insert th e backing plate into the three matching holes on the top of the mobile board. the adhesive will hold the backing plate in place while you are attaching the thermal module. 4. attach the thermal module to the mobile board using the eight captive screws as shown in the figure. tighten the screws as follows: a. starting with screw , loosely tighten the screws in numerical order. b. securely retighten each screw in the same order ( to ). 5. attach the thermal module fan connector ( figure 10, c) to the fan header ( figure 10, d) on the mobile board. installing and replacing mobile board components 39 figure 10. installing the thermal module intel mobile board MGM45WU product guide 40 attaching the i/o bezel to attach the i/o bezel to mobile board, see figure 11 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. slid e the i/o bezel ( figure 11, a) onto the edge of the mo bile board as shown in the figure. 3. install the hex standoffs ( figure 11, b) on the dvi-i connector. figure 11. attaching the i/o bezel installing and replacing mobile board components 41 installing a modem to install a mobile daughter card (mdc) modem-only card on the mobile board, see figure 12 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. insert the b lack connector ( figure 12, b) on the mode m cable into the connector on the modem card. these connectors are keyed and will fit only one way. 3. insert the white connector (figure 12, c) on the mode m cable into the connector on the mobile board. these connectors are keyed and will fit only one way. 4. align the connector on the bottom of the modem card with the matching mdc connector ( figure 12, d) on the mobile board and sec ure the modem card to the mobile board with two screws ( figure 12, e) as shown. figure 12. installing a modem intel mobile board MGM45WU product guide 42 installing expansion board a to install expansion board a in the d-tray, see figure 13 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. con nect the expansion board a cable connector ( figure 13, a) to the connector ( figure 13, b) on the bottom of expansion board a. 3. place e xpansion board a ( figure 13, c) into the d-tray ( figure 13, d) on the matchi ng standoffs ( figure 13, e). make sure that the i/o ports align with the chassis i/o port openings and the alignment pin ( figure 13, f). 4. route the expansion board a cable ( figure 13, g) through the chassis as shown in the fi gure. 5. secure expansion board a to the d-tray with four screws ( figure 13, h) as shown. figure 13. installing expansion board a in the d-tray installing and replacing mobile board components 43 installing the mobile board this section describes how to install the mo bile board in the notebook chassis. the installation consists of the following procedures: 1. connecting the mobile board to expansion board a 2. attaching the c-plate to the d-tray before you perform these procedures , observe the precautions in " before you begin" on page 35. connecting the mobile board to expansion board a to connect the mobile board to expansion board a, see figure 14 and follow these steps: 1. c onnect the expansion board a cable ( figure 14, b) to the expansion board a connector ( figure 14, a) on the bottom of the mobile board. 2. turn the board over and place it into the d-tray as show in the figure. take note of the location of the expansion board a board-to-board connector ( figure 14, d) on the bottom of the mobile board. 3. connect the mobile board board-to-board connector ( figure 14, d) to the board-to- board connector ( figure 14, c) on the top of ex pansion bo ard a and snap them together. the mobile board mounting holes will align with the matching standoffs in the d-tray. 4. secure the mobile board to expansion board a with the screw ( figure 14, e) supplied with expansion board a. intel mobile board MGM45WU product guide 44 figure 14. connecting the mobile board to expansion board a installing and replacing mobile board components 45 attaching the c-plate to the d-tray to complete the installation of the mobile board, attach the c-plate to the d-tray. see figure 15 and follow these steps: 1. turn the c-plate ( figure 15, a) over so the top side is facing up as shown in the fi gure and place it on the matching standoffs in the d-tray ( figure 15, b). 2. parti ally secure the c-plat e with an m2.5x6 screw ( figure 15, c). 3. turn the c-plate/d-tray over and se cure it with 11 m2.5x6 screws ( figure 15, d) at the locations indicated in the figure . figure 15. attaching the c-plate to the d-tray intel mobile board MGM45WU product guide 46 connecting cables to the bottom of the mobile board this section describes where to connect va rious cables to the bottom of the mobile board after it has been installed in th e chassis. to connect the cables, see figure 16 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. with the chassis oriented as sho wn in figure 16 (bottom side faci ng up), connect the cable from expansion board b to the expansion board b connector ( figure 16, b) on the mobile board. 3. con nect the bluetooth cable to the bluetooth connector ( figure 16, a) on the m obile board. 4. connect the speakers cable to the speakers connector ( figure 16, c) on the mobile board. figure 16. connecting cables to the bottom of the mobile board installing and replacing mobile board components 47 attaching the touch pad and the fingerprint reader (optional) cables this section describes how to connect the to uch pad and fingerprint reader cables to the mobile board after it has been installed in the chassis. to connect the cables, see figure 17 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. turn the chassis over so that it is orien ted (top side up) as shown in figure 17. 3. if the touch pad installed in the c-tray includes an optional fingerprint reader, there will be two cables to connect. the touch pad cable attaches to the touch pad connector ( figure 1, h) and the fingerprint read er cable attaches to id expansion connector b ( figure 1, g). the installation process is the same for both cables. 4. to connect either of the cables: a. open the connector locking mechanism ( figure 17, a) by sliding it out as shown i n the figure. b. insert the cable into the connector ( figure 17, b). c. p ush the locking mechanism ( figure 17, a) back in to lock the cable in place. intel mobile board MGM45WU product guide 48 figure 17. attaching the touch pad and fingerprint reader cables installing and replacing mobile board components 49 attaching the lid/lcd this section describes how to attach th e lid/lcd to the chassis and connect the associated cables. see figure 18 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. pl ace the lid/lcd hinges over the matching holes in the chassis. note that each hinge has an alignment pin. attach the hinges ( figure 18, a) wi th two screws as shown in the figure. 3. connect the lcd vide o cable connector ( figure 18, c) to the lvds connector ( figure 18, d) on the mobile board. 4. route the three antenna cables (figure 18, e) under the c-plate to the mobile board. these cables will be connected in a later section. intel mobile board MGM45WU product guide 50 figure 18. attaching the lid/lcd to the hinges and connecting the lvds cable installing and replacing mobile board components 51 5. close the lid and turn the chassis over. 6. secure the hinge alignment pins with two screws through the bottom of the chassis as shown in figure 19. figure 19. securing the lid/lcd hinge alignment pins intel mobile board MGM45WU product guide 52 installing an optical disk drive to install an optical disk drive in the chassis, see figure 20 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. attach the disk drive mounting bracket ( figure 20, a) to the rear of the optical disk drive with two screws ( figure 20, b) as shown. 3. snap the be zel ( figure 20, c) onto the front of the optical disk drive. note if there is a bezel already attached to the front of the optical disk drive, remove it. you must replace it with the bezel that was included with your chassis for a proper fit. 4. insert the optical disk drive into the chassis opening as sh own in the figure so that it engages the mobile board connector. secu re the optical disk drive to the chassis with a screw ( figure 20, d) as shown in the figure. figure 20. installing an optical disk drive installing and replacing mobile board components 53 installing a hard disk drive to install a hard disk drive in the chassis, see figure 21 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. attach the disk drive mounting bracket ( figure 21, a) to the hard disk drive ( figure 21, b) with four screws ( figure 21, c) as shown. 3. insert the hard disk drive/bracket assembly into the disk drive bay ( figure 21, e) and enga ge the mobile board connector. you can use the pull tab ( figure 21, d) to f acilitate installation. figure 21. installing a hard disk drive intel mobile board MGM45WU product guide 54 installing a keyboard and keyboard cover this section describes how to install a keyboa rd and a keyboard cover in the chassis. be sure to observe the precaution s in "before you begin" on page 35. installing a keyboard the keyboard cable ( figure 22, a) is located on the bottom of the keyboard. to install a keyboard and connect it to the mobile board, see figure 22 and follow these steps: 1. locate the keyboard connector ( figure 22, b) on the mobile board and unlock the connector l ocking mechanism ( figure 22, c) by ro tati ng it upward. 2. insert the keyboard cable into the conne ctor and rotate the connector locking mechanism downward as shown in the figure to lock the cable in place. 3. install the keyboard by inserting the edge tabs ( figure 22, d) into the matching sl ots in the c-tray and slide the keyboard into place. figure 22. installing a keyboard installing and replacing mobile board components 55 installing the keyboard cover to install the keyboard cover ( figure 23, a), see figure 23 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. in sert the two tabs ( figure 23, b) on the front edge of the keyboard cover into the corresponding slots ( figure 23, c) in the c-tray (make sure that the keyboard is attached under the keyboard cover) and ro tate the cover downward until it snaps into place. 3. close the lid and turn the chassis over. secure the keyboard cover with two screws ( figure 23, d) through the battery bra cket as shown in the figure. figure 23. installing a keyboard cover intel mobile board MGM45WU product guide 56 installing system memory the mobile board includes two so-dimm sock ets that support up to 4 gb of system memory. to install system memory on bottom of the mobile board, see figure 25 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. locate the memory sockets ( figure 2, v and u). 3. in stall the first (or only) dimm in the bottom (dimm 1) socket ( figure 25, b). hold the dim m ( figure 25, a) with the back edge tilted slightly upwards, insert the dim m in the socket and gently push the back edge of the dimm down until it snaps into the retention arms ( figure 25, c). 4. if you are installing a second dimm, repeat step 3 using the top (dimm 2) socket ( figure 25, d). figure 24. installing dimms installing and replacing mobile board components 57 installing a wireless lan card a wireless lan card can be installed in either the mobile board?s pci express full-mini connector ( figure 2, j) or its pci expr ess half-mini card co nnector ( figure 2, p). t o install a wireless lan card on the mobile board, see figure 25 and figure 26 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. insert the wireless lan card ( figure 25, a and figure 26, a) into the pci express mi ni card connector ( figure 25, b and figure 26, b) at a slightly upward angle. 3. al ign the mounting holes ( figure 25, c and figure 26, c) and snap the card in place. figure 25. installing a pci express full-mini wireless lan card intel mobile board MGM45WU product guide 58 figure 26. installing a pci expr ess half-mini wireless lan card 4. attach the antenna wires ( figure 27, a) to the connectors ( figure 27, b) on the wireless lan card as shown. figure 27. connecting the antenna wires installing and replacing mobile board components 59 installing an intel ? turbo memory card an intel turbo memory card can be installed in either the mobile board?s pci express full-mini connector ( figure 2, j) or its pci expr ess half-mini card connector ( figure 2, p). t o install an intel turbo memory card on the mobile board, see figure 28 and figure 29 and follow these steps: 1. observe the precautions in " before you begin" on page 35. 2. insert the i ntel turbo memory card ( figure 28, a and figure 29, a) into the pci express mini card connector ( figure 28, b and figure 29, b) at a slightly upward angle. 3. al ign the mounting holes ( figure 28, c and figure 29, c) and snap the card in place. figure 28. installing a pci express full-mini intel turbo memory card intel mobile board MGM45WU product guide 60 figure 29. installing a pci expre ss half-mini intel turbo memory card installing and replacing mobile board components 61 setting the bios configuration jumper ensure that the bios configuration jumper is set to normal (pins 1 and 2) as shown in figure 30 before finishing assembly of the cha ssis. if the jumper is not in the correct position, move it to the co rrect position. refer to table 14 for a description of the jumper settings. figure 30. bios configuration jumper table 14. jumper settings for the bios setup program modes jumper setting mode description normal (default) (1-2) the bios uses the current configuration and passwords for booting. configure (2-3) after the power-on self-test (post) runs, the bios displays the maintenance menu. use this menu to clear passwords. recovery (none) the bios recovers data in the event of a failed bios update. intel mobile board MGM45WU product guide 62 completing assembly of the chassis this section describes how to complete chassis assembly by installing the hard disk drive bay cover and the d-tray door. observe the precautions in " before you begin" on page 35 while performing these procedures. installing the hard disk drive bay cover to install the hard disk drive bay cover, see figure 31 and follow these steps: 1. al ign the two tabs ( figure 31, b) on the hard disk drive bay cover ( figure 31, a) wi th the matching slots in the d-tray and lower the cover into place over the hard disk drive bay ( figure 31, c). 2. secure the cover to the d-tray with two screws ( figure 31, d) as shown in the fi gure. figure 31. installing the hard disk drive cover installing and replacing mobile board components 63 installing the d-tray door to install the d-tray door, see figure 32 and follow these steps: 1. al ign the d-tray door ( figure 32, a) with the opening in the d-tray and lower the door i nto place. 2. secure the door to the d-tray with nine screws ( figure 32, b) as shown in the fi gure. figure 32. installing the d-tray door intel mobile board MGM45WU product guide 64 clearing or changing passwords this section describes how to clear or change the following passwords: ? bios security passwords (user and supervisor) ? hard disk drive passwords (user and master) clearing bios security passwords this procedure assumes that the board is installed in the chassis and the bios configuration jumper is set to normal mode. 1. observe the precautions in " before you begin" on page 35. 2. turn off all peripheral devi ces connected to the computer. turn off the computer, disconnect the computer?s ac power ad apter (if connected), and remove the battery pack. 3. turn the computer over and remove the d-tray door by removing the nine screws holding it in place (see figure 32). 4. locate the bios configuration jumper (see figure 30). 5. place the jumper on pins 2-3 as shown below. 6. reassemble the computer, insert the batte ry pack in the computer, turn on the computer, and allow it to boot. 7. the computer starts the setup program. setup displays the maintenance menu. 8. use the arrow keys to select clear passwo rds. press installing and replacing mobile board components 65 clearing or changing hard disk drive passwords this section describes how to clear or ch ange user and master hard disk drive passwords. the procedures for clea ring the passwords are as follows: ? user hard disk drive passwords: if a valid user hard disk drive password has been entered and the user wishes to change or delete the password, the user must first enter the existing user hard disk drive password in bios se tup for security confirmation. to delete an existing user hard disk drive password, the user can enter a blank password for the new password. ? master hard disk drive passwords: if a valid master hard disk drive password has been entered and the user wishes to change or delete the password, the user must first enter the existing master hard disk drive password in bios se tup for security confirmation. to delete an existing master hard disk drive password, the user can enter a blank password for the new password. intel mobile board MGM45WU product guide 66 67 3 updating the bios the bios setup program can be used to vi ew and change the bios settings for the computer. you can access the bios setup program by pressing the intel mobile board MGM45WU product guide 68 updating the bios with the iso image bios update file or the iflash memory update utility you can use the information in this section to update the bios using either the iflash memory update utility or the iso image bios update file. obtaining the bios update file you can update to a new version of the bios by using the iso image bios update file (recommended), or iflash bios update file. the iso image bios update file is a standa rdized image of a b ootable cd-rom that can be used to create a bootable cd that will update the bios. the iflash bios update file is a compressed file that contains the files you need to update the bios. the iflash bios update file contains: ? new bios file (including the intel ? management engine firmware image) ? intel ? integrator toolkit configuration file (optional) ? intel flash memory update utility you can obtain either of these files through your computer supplier or by navigating to the intel mobile board MGM45WU page on the intel world wide web site. navigate to the intel mobile board mgm45w u page. under the ?software and drivers? heading, click on ?latest bios? to locate th e latest bios files. click on the ?bios update? link and select the iso image bios update file or the iflash bios update file. updating the bios with the iso image bios update file the iso image bios update allows for the update of an intel ? mobile board bios to the latest production release regardless of the operating system installed on the computer's hard drive and without the need to remove the bios configuration jumper. it requires a blank cd-r, a read/writeab le cd drive, and software capable of uncompressing and writing the iso image file to cd. the image uses isolinux* bootloader and automatically launches a script to upgrade the bios via the iflash utility. updating the bios 69 caution do not interrupt the process or the system may not function properly. follow these instructions to upgrade th e bios using the iso image bios file: 1. download the iso image bios file. 2. using software capable of un compressing and writing an iso image file to cd, burn the data to a blank cd. note copying the iso image bios file to cd will not work. the completed cd should contain multiple files and a directory. 3. insert the cd that was cr eated in the cd-rom drive of the computer to be upgraded and boot the system. 4. when the "press enter to co ntinue booting from cd-rom" prompt appears, press the enter key. the system will boot from the hard drive if no key is pressed within 15 seconds. 5. at the "welcome to the intel mobile board bios upgrade cd-rom" page, press any key to confirm the bios upgrade operation. 6. wait for the bios upgrade process to complete. caution do not power down your computer before the update is complete. the update may take up to 5 minutes. updating the bios with the iflash memory update utility with the iflash memory update utility you can update the system bios from a bootable cd-rom, bootable usb flash drive, or other bootable usb media. the utility available on the intel world wide web site provides a simple method for creating a bootable cd-rom that will automatically update your bios. the iflash bios update files can also be extracted lo cally to your hard drive and copied to a bootable usb flash drive or other bootable usb media. the iflash memory update utility allows you to: ? update the bios and intel management engine in flash memory ? update the language section of the bios note review the instructions distributed with th e update utility before attempting a bios update. intel mobile board MGM45WU product guide 70 caution do not interrupt the process or the system may not function properly. 1. uncompress the bios update file and copy the .bio file, iflash.exe, and .itk file (optional) to a bootable usb flash drive or other bootable usb media. 2. configure the bios or use the f10 option during post to boot to the usb device. 3. manually run the iflash.exe file from the usb device and manually update the bios. recovering the bios it is unlikely that anything will interrupt the bios update; however, if an interruption occurs, the bios could be damaged. due to bios size and recovery requirements, a cd-r with the .bio file in the root directory will be required. note for more information about updating the inte l mobile board bios or recovering from a bios update failure, go to http://support.intel.com/support/mot herboards/desktop /sb/cs-022312.htm . 71 a intel ? mobile utility this appendix describes the functions of the intel ? mobile utility software included on the intel ? express installer dvd. with the intel mobile utility software installed, pressing the function key combinations shown below will allow you to activate or control the following notebook functions: ? sleep/hibernate ? wireless radio ? video output ? display brightness ? audio volume function key display sleep/hibernate a screen pops up allowing you to select either sleep mode or hibernate mode. click the button and the notebook will enter sleep mode or hibernate mode. to exit the screen, click the close button or the button. intel mobile board MGM45WU product guide 72 function key display wireless radios on/off a screen pops up allowing you to turn or off the wireless lan and bluetooth feature. click the button to turn the feature on or off. to ex it the screen, click the close button or the button. video output selection a screen pops up that presents a menu of all the external display options available to you. connect the external display and select the appropriate menu item. to exit the screen, click the close button or the button. menu when the notebook is not attached to a docking station intel mobile utility 73 function key display video output selection menu when the notebook is attached to a docking station adjust display brightness a bar briefly appears on the screen when you use these hot keys to the adjust the display brightness level. mute audio this icon briefly appears on the screen to indicate that the sound is muted when you press this hot key. adjust volume a bar briefly appears on the screen when you use these hot keys to adjust the audio volume of your notebook. intel mobile board MGM45WU product guide 74 75 b regulatory compliance this appendix contains the following regulatory compliance information for intel mobile board MGM45WU: ? safety standards ? european union declaration of conformity statement ? product ecology statements ? electromagnetic compatibility (emc) regulations ? product certifications safety standards intel mobile board MGM45WU complies wi th the safety standards stated in table 15 w hen correctly installed in a compatible chassis. table 15. safety standards regulation title csa/ul 60950-1, first edition information technology equipment ? safety - part 1: general requirements (usa and canada) en 60950-1:2006, second edition information technology equipment ? safety - part 1: general requirements (european union) intel mobile board MGM45WU product guide 76 battery disposal information a lithium coin-cell battery (cr2032) powers the real-time clock and cmos memory on the mobile board. when the computer is not plugged into a wall socket, the battery has an estimated life of three years. if the battery requires replacem ent, observe the caution below. caution risk of explosion if the battery is replaced with an incorrect type. batteries should be recycled where possible. disposal of used batteries must be in accordance with local environmental regulations. prcaution risque d'explosion si la pile usage est remplace par une pile de type incorrect. les piles usages doivent tre recycles dans la mesure du possible. la mise au rebut des piles usages doit respecter les rglementa tions locales en vigueur en matire de protection de l'environnement. forholdsregel eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. batterier b?r om muligt genbruges. bortskaffels e af brugte batterier b?r foreg? i overensstemmelse med g?ldende milj?lovgivning. obs! det kan oppst? eksplosjonsfare hvis batteriet skiftes ut med feil type. brukte batterier b?r kastes i henhold til g jeldende milj?lovgivning. viktigt! risk f?r explosion om batteriet ers?tts med fe laktig batterityp. ba tterier ska kasseras enligt de lokala milj ?v?rdsbest?mmelserna. varo r?j?hdysvaara, jos pariston tyyppi on v??r ?. paristot on kierr?tett?v?, jos se on mahdollista. k?ytetyt paristot on h?vi tett?v? paikallisten ymp?rist?m??r?ysten mukaisesti. vorsicht bei falschem einsetzen einer neuen batterie besteht explosionsgefahr. die batterie darf nur durch denselben oder einen entsprechenden, vom hersteller empfohlenen batterietyp ersetzt werden. entsorgen si e verbrauchte batterien den anweisungen des herstellers entsprechend. regulatory compliance 77 avvertimento esiste il pericolo di un espl osione se la pila non viene sostituita in modo corretto. utilizzare solo pile uguali o di tipo equivale nte a quelle consigliate dal produttore. per disfarsi delle pile usate, seguir e le istruzioni del produttore. precaucin existe peligro de explosin si la pila no se cambia de forma adecuada. utilice solamente pilas iguales o del mismo tipo qu e las recomendadas por el fabricante del equipo. para deshacerse de las pilas usad as, siga igualmente las instrucciones del fabricante. waarschuwing er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. batterijen moeten zoveel moge lijk worden gerecycled. houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. aten??o haver risco de explos?o se a bateria for su bstituda por um tipo de bateria incorreto. as baterias devem ser recicladas nos locais apropriados. a elimina??o de baterias usadas deve ser feita de acordo com as regulamenta??es ambientais da regi?o. a?ciaro?zna?? ?? ?? ?? , ??? ??????? ????? ???????? . ????? ???? , ?????? , ?????? . ????? ? ? ?????? ??? ???? ?? ?????????? ????? . upozornn v p ? pad vym ny baterie za nesprvny druh m ? ?e dojt k vybuchu. je-li to mo?n, baterie by m ly byt recyklovny. baterie je t ? eba zlikvidovat v souladu s mstnmi p? edpisy o ?ivotnm prost ? ed. ????? ????? ?????? ?? ???? ? ????? ? ??? ????????? ? ? ??????? ??. ? ???? ? ?? ? ????????? ?? ?? ???? ?? ???? . ????? ?? ????????????? ???? ?? ? ???? ????? ? ??? ?? ? ???|????????? ????????? . vigyzat ha a telepet nem a megfelel ? tpus telepre cserli, az felrobbanhat. a telepeket lehet ? sg szerint jra kell hasznostani. a hasz nlt telepeket a helyi k?rnyezetvdelmi el ? rsoknak megfelel ? en kell kiselejtezni. intel mobile board MGM45WU product guide 78 awas risiko letupan wujud jika bateri digantikan dengan jenis yang ti dak betul. bateri sepatutnya dikitar semula jika boleh. pe lupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. ostrze?enie istnieje niebezpiecze stwo wybuchu w przypadku zastosowania niew ? a ? ciwego typu baterii. zu ? yte baterie nale ? y w miar ? mo ? liwo ? ci utylizowa ? zgodnie z odpowiednimi przepisami ochrony ? rodowiska. precau?ie risc de explozie, dac ? bateria este ?nlocuit ? cu un tip de baterie necorespunz ? tor. bateriile trebuie reciclate, dac ? este posibil. depozitarea bateriilor uzate trebuie s ? respecte reglement ? rile locale privind protec ? ia mediului. ??????? ??????? ???? ??????? ? ??? ? ? ???. ???? ???? ? ???????? ????? . ?????? ???? ???? ??? ?????, ???? ??? ?????? . upozornenie ak batriu vymente za nesprvny typ, hroz nebezpe ? enstvo jej vybuchu. batrie by sa mali pod ? a mo?nosti v?dy recyklova ? . likvidcia pou?itych batri sa mus vykonva ? v slade s miestnymi predpismi na ochranu ?ivotnho prostredia. pozor zamenjava baterije z baterijo druga ? nega tipa lahko povzro ? i eksplozijo. ? e je mogo ? e, baterije reciklirajte. rabljene bate rije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . regulatory compliance 79 uyari yanl ? trde pil tak ld ? nda patlama riski vard r. piller mmkn oldu ? unda geri d?n ? trlmelidir. kullan lm ? piller, yerel ?evre yasalar na uygun olarak at lmal d r. o? ?????? ???? ?????? ? , ???? ?????? ??? ??? . ? ????? , ?????? ???? ? ????? . ????? ??????? ???? ?? ? ?????? ???? ???? ? , ??? ? ????? . intel mobile board MGM45WU product guide 80 european union declaration of conformity statement we, intel corporation, declare under our sole responsibility that the product intel ? mobile board MGM45WU is in conformity with all applicable essential requirements necessary for ce marking, following the provisions of the european council directives 2004/108/ec (emc directive) and 2006/95/ec (low voltage directive). the product is properly ce marked demo nstrating this conformity and is for distribution within all member states of the eu with no restrictions. this product follows the provisions of the european directives 2004/108/ec and 2006/95/ec. ? tento vyrobek odpovd po?adavk ? m evropskych sm rnic 2004/108/ec a 2006/95/ec. dansk dette produkt er i overensstemmelse med det europ?iske direktiv 2004/108/ec & 2006/95/ec. dutch dit product is in navolging van de bepalingen van europees directief 2004/108/ec & 2006/95/ec. eesti antud toode vastab euroopa di rektiivides 2004/108/ec ja 2006/95/ec kehtestatud n?uetele. suomi t?m? tuote noudattaa eu-direkti ivin 2004/108/ec & 2006/95/ec m??r?yksi?. fran?ais ce produit est conforme aux exig ences de la directive europenne 2004/108/ec & 2006/95/ec. deutsch dieses produkt entspricht den besti mmungen der europ?i schen richtlinie 2004/108/ec & 2006/95/ec. ??????? ? ? ??? ??????? ?? ????? ?? ?????? ????? 2004/108/ec ? 2006/95/ec. magyar e termk megfelel a 2004/108/ec s 2006/95/ec eurpai irnyelv el ? rsainak. icelandic tessi vara stenst reglugere evrpska efnahags bandalagsins nmer 2004/108/ec & 2006/95/ec. italiano questo prodotto conforme alla direttiva europea 2004/108/ec & 2006/95/ec. latvie?u ?is produkts atbilst eiropas direkt vu 2004/108/ec un 2006/95/ec noteikumiem. regulatory compliance 81 lietuvi? ?is produktas atitinka europos direktyv ? 2004/108/ec ir 2006/95/ec nuostatas. malti dan il-prodott hu konformi mal-pr ovvedimenti tad-direttivi ewropej 2004/108/ec u 2006/95/ec. norsk dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/ec & 2006/95/ec. polski niniejszy produkt jest zgodny z post anowieniami dyrektyw unii europejskiej 2004/108/ec i 2006/95/ec. portuguese este produto cumpre com as norm as da diretiva europia 2004/108/ec & 2006/95/ec. espa?ol este producto cumple con las no rmas del directivo europeo 2004/108/ec & 2006/95/ec. slovensky tento produkt je v slade s ustanoveniami eurpskych direktv 2004/108/ec a 2006/95/ec. sloven? ? ina izdelek je skladen z dolo ?bami evropskih dire ktiv 2004/108/ec in 2006/95/ec. svenska denna produkt har tillverkats i enlighet med eg-direktiv 2004/108/ec & 2006/95/ec. trk?e bu rn, avrupa birli ? i?nin 2004/108/ec ve 2006/95/ ec y?nergelerine uyar. product ecology statements the following information is provided to address worldwide product ecology concerns and regulations. recycling considerations as part of its commitment to environmenta l responsibility, intel has implemented the intel ? product recycling program to allow retail consumers of intel?s branded products to return used products to selected locations for proper recycling. please consult http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructio ns, terms and conditions, etc. ?????????? intel product recycling program ?????????????????? ???? http://www.intel.com/intel /other/ehs/ product_ecology ????p??????? intel mobile board MGM45WU product guide 82 deutsch als teil von intels engage ment fr den umweltschutz ha t das unternehmen das intel produkt-recyclingprogramm implementiert, das einzelhandelskunden von intel markenprodukten erm?glicht, gebrauchte produkte an ausgew ?hlte standorte fr ordnungsgem??es recycling zurckzugeben. details zu diesem programm, einschlie?l ich der darin eingeschlossenen produkte, verfgbaren standorte, versandanweisungen, bedingungen usw., finden sie auf der http://www.intel.com/intel/other/ehs/product_ecology espa?ol como parte de su compromiso de responsabilidad medioambiental, intel ha implantado el programa de reciclaje de productos intel, que permite que los consumidores al detalle de los productos in tel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de env o, trminos y condiciones, etc. fran?ais dans le cadre de son engagement pour la protection de l'environnement, intel a mis en ?uvre le programme intel product recycling program (programme de recyclage des produits intel) pour permettre aux cons ommateurs de produits intel de recycler les produits uss en les retournant des adresses spcifies. visitez la page web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les conditions gnrales, etc. ?Z ???ho??h???K? ?u???????m??u?? ??k?? u????s????? http://www.intel.com/in tel/other/ehs/product_ecology ?ZE malay sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, intel telah melaksanakan program kitar semula produk untuk membenarkan pengguna-pengguna runcit produk jenama intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. regulatory compliance 83 portuguese como parte deste compromisso com o respei to ao ambiente, a intel implementou o programa de reciclagem de produtos para que os consum idores finais possam enviar produtos intel usados para locais selecionad os, onde esses produtos s?o reciclados de maneira adequada. consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em ingls) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponveis, as in stru??es de envio, os termos e condi??es, etc. russian ???? ? ?? ????? ???? ?? , intel ???? ???? ?????? ??? intel (product recycling program) ?? ???????? ???? ?????? ?? ??? intel ????? ???? ????? ??? ??????????? ?? ?? ???? ?????? . ???? , ???? ? ?? - ?? http://www.intel.com/intel/other/ehs/product_ecology ? ?????? ???? , ??????? ??? , ??? ???, ???? ??? , ????? ??? . . trk?e intel, ?evre sorumlulu ?una ba ? ml l ? n n bir par?as olarak, perakende tketicilerin intel markal kullan lm ? rnlerini belirlenmi ? merkezlere iade edip uygun ?ekilde geri d?n ? trmesini ama?layan intel rnleri geri d?n ? m program ?n uygulamaya koymu ? tur. bu program n rn kapsam , rn iade merkezleri, nakliye talimatlar , kay tlar ve ? artlar v.s dahil btn ayr nt lar n ?grenmek i?in ltfen http://www.intel.com/intel/other/ehs/product_ecology web sayfas na gidin. intel mobile board MGM45WU product guide 84 lead-free 2li/pb-free 2li board the electronics industry is transitioning to european union (eu) restriction of hazardous substances (rohs)-compliant prod ucts. the rohs legislation restricts the use of six materials. one of these restrict ed materials is lead. lead is the most common and problematic of the rohs restricted materials. there are exemptions in rohs that allow the use of lead in some very limited locations in electronic products. maximum lead conc entration values have been established for rohs-compliant electronic products th at allow up to 1000 ppm of lead. lead-free/pb-free is a nickname that is often used (or misused) for rohs-compliant products. in this case, the term "lead- free/pb-free" means that lead has been removed where required by the rohs legislation but still may exist as an impurity below 1000 ppm. the term "lead-free 2li/pb-free 2li" means le ad-free second level interconnect (2li). the balls, leads, or pads used to connect the component to a printed circuit board are lead-free, but the first level interconnect (fli) is not lead-free. the use of lead in the fli is acceptable because of the rohs "flip chip" or "die bump" interconnect exemption. intel mobile board MGM45WU is a lead-free second level interconnect product. table 16 shows the lead-free second level in terconnect marks as they appear on the board and accompanying collateral. th ese marks are based on jedec standard j-std-609, ?marking and labeling of compon ents, pcbs and pcbas to identify lead, lead free and other attributes.? for more information concerning intel?s lead-free initiatives, refer to http://www.intel.com/technology/silicon/leadfree.htm . regulatory compliance 85 table 16. lead-free second level interconnect marks description mark this symbol is used to identify electrical and electronic assemblies and components in which the pb concentration level in the board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm). or or restriction of hazardous substances (rohs) eu rohs eu rohs directive 2002/95/ec restricts the use of the following six materials in various types of electronic and electrical equipment: ? lead ? mercury ? cadmium ? hexavalent chromium ? polybrominated biphenyls (pbb) ? polybrominated diphenyl ether (pbde) the maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material. intel mobile board MGM45WU complies with these restrictions. intel mobile board MGM45WU product guide 86 china rohs ?china rohs? is the term used by industry generally to describe legislation implemented by the ministry of information industry (mii) in the people's republic of china for the control of pollution by electronic information products (eip). the official title of the china rohs regulation is ?management methods for controlling pollution by electronic information products.? china rohs bans the same substances and has the same limits as eu rohs. however, the china rohs regulation requires specific product marking and a self- declaration of the controlled substanc es contained in each product. intel mobile board MGM45WU is a china rohs-compliant product. the required china rohs mark indicates the product?s environmental friendly usage period (efup). the efup is defined as th e number of years for which listed controlled substances will not leak or chemically deteriorate while in the product. the efup for intel mobile boards has been determined to be 10 years. the efup for intel mobile board MGM45WU is shown in table 17. table 17. china rohs environmentally friendly use period mark description mark this is an example of the symbol used on intel mobile boards and associated collateral. the color of the mark may vary depending upon the application. the environmental friendly usage period (efup) for intel mobile boards has been determined to be 10 years. regulatory compliance 87 the china mii stipulates that a material self declaration table (sdt) must be included in a product?s user documentation. th e sdt for intel mobile board MGM45WU is shown in figure 33. figure 33. intel mobile board MGM45WU china rohs material self declaration table intel mobile board MGM45WU product guide 88 emc regulations intel mobile board MGM45WU complies with the emc regulations stated in table 18 w hen correctly installed in a compatible host system. table 18. emc regulations regulation (class b) title fcc 47 cfr part 15, subpart b title 47 of the code of federal regulations, part 15, subpart b, radio frequency devices. (usa) ices-003 issue 4 interference-causing equipment standard, digital apparatus. (canada) en55022:2006 limits and methods of measurement of radio interference characteristics of information technology equipment. (european union) en55024:1998 information technology equipment ? immunity characteristics limits and methods of measurement. (european union) en55022:2006 australian communications authority, standard for electromagnetic compatibility. (australia and new zealand) cispr 22:2005 +a1:2005 +a2:2006 limits and methods of measurement of radio disturbance characteristics of information technology equipment. (international) cispr 24:1997 +a1:2001 +a2:2002 information technology equipment ? immunity characteristics ? limits and methods of measurement. (international) vcci v-3/2007.04, v-4/2007.04 voluntary control for interference by information technology equipment (japan) japanese kanji statement translation: this is a class b product based on the standard of the voluntary control council for interference from information technology equipment (vcci). if this is used near a radio or television re ceiver in a domestic environment, it may cause radio interf erence. install and use the equipment according to the instruction manual. regulatory compliance 89 korean class b statement translation: this is household equipment that is certified to comply with emc requirements. you may use this equipment in residential environments and other non-residential environments. ensure electromagnetic compatibility (emc) compliance before computer integration, make sure th at the power supply and other modules or peripherals, as applicable, have pass ed class b emc testing and are marked accordingly. pay close attention to the following when reading the installation instructions for the host chassis, power supply, and other modules: ? product certifications or lack of certifications ? external i/o cable shielding and filtering ? mounting, grounding, and bonding requirements ? keying connectors when mating the wrong connectors could be hazardous if the power supply and other modules or pe ripherals, as applicable, are not class b emc compliant before integration, then emc testing may be required on a representative sample of th e newly completed computer. intel mobile board MGM45WU product guide 90 product certifications board-level certification markings intel mobile board MGM45WU has the product certification markings shown in table 19. table 19. product certification markings description mark ul joint us/canada recognized comp onent mark. includes adjacent ul file number for intel mobile boards: e210882. fcc declaration of conformity logo mark for class b equipment. includes intel name and MGM45WU model designation. ce mark. declaring compliance to european union (eu) emc directive and low voltage directive. australian communications authority (aca) and new zealand radio spectrum management (nz rsm) c-tick mark. includes adjacent intel supplier code number, n-232. japan vcci (voluntary control council for interference) mark. s. korea mic (ministry of information and communication) mark. includes adjacent mic certificat ion number: cpu-MGM45WU (b). taiwan bsmi (bureau of standard s, metrology and inspections) mark. includes adjacent intel company number, d33025. printed wiring board manufacturer?s recognition mark. consists of a unique ul recognized manufacturer?s logo, along with a flammability rating (solder side). v-0 regulatory compliance 91 chassis and component certifications ensure that the chassis and certain componen ts; such as the power supply, peripheral drives, wiring, and cables; are components certified for the coun try or market where used. agency certification marks on the product are proof of certification. typical product certifications include: in europe the ce marking signifies compliance with all applicable european requirements. if the chassis and other components are not proper ly ce marked, a supplier?s declaration of conformity statement to the european em c directive and low voltage directive (as applicable), should be obtained. additionally, other directives, such as the radio and telecommunications terminal equipment (r&tte) directive may also apply depending on product features. in the united states a certification mark by a nationally recognized testing laboratory (nrtl) such as ul, csa, or etl signifies compliance with safe ty requirements. wiri ng and cables must also be ul listed or recognized and suitab le for the intended use. the fcc class b logo for home or office use signifies co mpliance with electromagnetic interference (emi) requirements. in canada a nationally recognized certification mark such as csa or cul signifies compliance with safety requirements. the indu stry canada statement at the front of this product guide demonstrates compliance with canadian emc regulations. intel mobile board MGM45WU product guide 92 |
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